Title: Assistant Professor
Institution: Boise State University
Address: 1020 S Manitou Ave, Room MEC 202G, Boise State University, Boise, Idaho 83706
Email: omiyahassan@boisestate.edu
Phone: (208) 426-4803
Visit Omiya’s Research Website
Research Interests: Sensor electronics, integrated circuit, firmware, wearable tracker, AI algorithm development, real-time embedded system.
Biographical Sketch:
Dr. Hassan is an experienced researcher and engineer with over 6 years of expertise in VLSI and integrated circuit design. With a strong background in industry and academia, she has worked on developing firmware and designing electronics for sensor-based applications. Her research interests lie in designing low-power and AI integrated electronics for a broad range of environmental and biomedical applications. At Boise State Dr. Hassan is focused on solving the energy-efficiency problem in embedded systems and integrated circuits. Her low-power integrated circuit and embedded systems laboratory (LPiNS) develops methodologies for low-power integrated circuits (IC) and hardware modeling for computer processors. With a background in computing, integrated circuits, and embedded systems, the team works in designing energy-efficient artificial intelligence (AI) electronics, algorithms, and processors. Before coming to Boise State as an academic, Dr. Hassan, during her doctoral studies, worked at Meta Reality Labs in Redmond, Washington, as a research scientist working on the Sensors group on developing wearable systems and devices.
Dr. Hassan received the IEEE Instrumentation and Measurement Society’s Graduate Research Fellowship Award in 2021, achieved the Outstanding Doctoral Student Award of 2021 from the Department of EECS at the University of Missouri, and was awarded the University of Missouri’s Outstanding Undergraduate Research Mentor of the year 2022. She is a fellow 2022 Rising Star of Electrical Engineering and Computer Science (EECS).
Professional Certifications:
IRB certification for biomedical researchers offered by CITI Program, issued October 2023, Cred ID 58232589